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Description Capabilities
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1. Product Range 2-10L (HDI:1+n+1; 2+n+2)
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2. Board thickness 0.2mm- - -3.0mm
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3. Copper Foil Inner: 3oz, Outer: 4oz
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4. Board thickness’ tolerance +/-10%-----+/-8%
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5. Material FR4+PI
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6. Surface treatment HASL, HASL Lead free, OSP,
Plating gold(1u”-50u”) ENIG(1u”-8u”) Gold Finger(1u”-50u”)
Immersion silver, Immersion Tin(0.8-1.5um)
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7. Size of finished product Min: 10*10mm, Max: 1200*500mm
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8. Min. mechanical via holes & pad Holes: 0.2mm/pad: 0.4mm,
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9. Min Laser drilling holes & pad 0.1mm, pad<0.1mm
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10. Min. hole tolerance +/-0.05mm(NPTH), +/-0.075mm(PTH)
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11. Min copper thickness of holes’wall 20um
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12 Min space of drilling holes to conductor 0.15mm(<8L); 0.2mm(8L<14L);0.225mm(<=24L)
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13. Min. conductor width/space 0.075/0.075mm(3/3mil)
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14. Min size of solder PAD/Annulus Pad:0.4mm/0.3mm(Laser dill), Annulus:0.1mm
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15. Hole wall to conductor Innerlayers of multilayer 0.2mm
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16. Hole to hole edge gap 0.8mm
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17. Solder mask color & Thickness Color: Green, Black, Yellow, Blue, Red, White, Matt green
Thickness: 10-20um
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18. Silk-screen color White, Black, Yellow
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19. Profile tolerance +/-0.15mm(Routing), +/-0.1mm(Punching)
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20. Min space from conductor/holes to edge 0.15mm/0.2mm
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21. Warp & twist 0.3%-0.7%
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22. Thickness of peelablemask 0.2-0.5mm (Max plugging holes: 4.5mm)
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23. Bevel angle of gold finger 20，30，45，60(Tolerance: +/-5 degree)
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24. Impedance tolerance +/-5ohm(〈 50ohm)；+/-10%(〉50ohm)
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25. V-CUT board thickness 0.6-3.0mm
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26. Max multi-press 〈=3
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27. Min tolerance of milling slot +/-0.15mm
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28. Ratio of board thickness/holes size 12 ：1
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