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Description
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Capabilities
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1. Product Range
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1-14L (HDI:1+n+1; 2+n+2)
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2. Board thickness
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0.2mm- - -7.0mm
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3. Copper Foil
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Inner: 6oz, Outer: 4oz
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4. Board thickness’ tolerance
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+/-10%-----+/-8%
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5. Material
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FR4, KB , PTFE, ROGERS, ARLON, ISOLA,TACONIC IT180, Nelco
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6. Surface treatment
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HASL, HASL Lead free, OSP, Plating gold(1u”-50u”) ENIG(1u”-8u”)Gold Finger(1u”-50u”) Immersion silver, Immersion Tin(0.8-1.5um)
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7. Size of finished product
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Min: 10*10mm, Max: 1200*500mm
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8. Min. mechanical via holes & pad
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Holes: 0.2mm/pad: 0.4mm,
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9. Min Laser drilling holes & pad
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0.1mm, pad<0.1mm
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10. Min. hole tolerance
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+/-0.05mm(NPTH), +/-0.075mm(PTH)
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11. Min copper thickness of holes’wall
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20um
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12 Min space of drilling holes to conductor
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0.15mm(<8L); 0.2mm(8L<14L);0.225mm(<=24L)
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13. Min. conductor width/space
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0.075/0.075mm(3/3mil)
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14. Min size of solder PAD/Annulus
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Pad:0.4mm/0.3mm(Laser dill), Annulus:0.1mm
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15. Hole wall to conductor Innerlayers of multilayer
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0.2mm
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16. Hole to hole edge gap
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0.8mm
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17. Solder mask color & Thickness
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Color: Green, Black, Yellow, Blue, Red, White, Matt green
Thickness: 10-20um
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18. Silk-screen color
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White, Black, Yellow
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19. Profile tolerance
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+/-0.15mm(Routing), +/-0.1mm(Punching)
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20. Min space from conductor/holes to edge
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0.15mm/0.2mm
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21. Warp & twist
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0.3%-0.7%
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22. Thickness of peelablemask
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0.2-0.5mm (Max plugging holes: 4.5mm)
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23. Bevel angle of gold finger
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20，30，45，60(Tolerance: +/-5 degree)
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24. Impedance tolerance
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+/-5ohm(〈 50ohm)；+/-10%(〉50ohm)
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25. V-CUT board thickness
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0.6-3.0mm
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26. Max multi-press
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〈=3
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27. Min tolerance of milling slot
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+/-0.15mm
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28. Ratio of board thickness/holes size
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12 ：1
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